JPH0455826B2 - - Google Patents

Info

Publication number
JPH0455826B2
JPH0455826B2 JP58101398A JP10139883A JPH0455826B2 JP H0455826 B2 JPH0455826 B2 JP H0455826B2 JP 58101398 A JP58101398 A JP 58101398A JP 10139883 A JP10139883 A JP 10139883A JP H0455826 B2 JPH0455826 B2 JP H0455826B2
Authority
JP
Japan
Prior art keywords
workpiece
workpieces
transfer table
carrying
unprocessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58101398A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59227361A (ja
Inventor
Hatsuyuki Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Priority to JP58101398A priority Critical patent/JPS59227361A/ja
Publication of JPS59227361A publication Critical patent/JPS59227361A/ja
Publication of JPH0455826B2 publication Critical patent/JPH0455826B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP58101398A 1983-06-07 1983-06-07 平面研削装置 Granted JPS59227361A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58101398A JPS59227361A (ja) 1983-06-07 1983-06-07 平面研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58101398A JPS59227361A (ja) 1983-06-07 1983-06-07 平面研削装置

Publications (2)

Publication Number Publication Date
JPS59227361A JPS59227361A (ja) 1984-12-20
JPH0455826B2 true JPH0455826B2 (en]) 1992-09-04

Family

ID=14299624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58101398A Granted JPS59227361A (ja) 1983-06-07 1983-06-07 平面研削装置

Country Status (1)

Country Link
JP (1) JPS59227361A (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
DE4392793T1 (de) * 1992-06-15 1997-07-31 Speedfam Corp Verfahren und Vorrichtung zum Polieren von Wafern
JP3027882B2 (ja) * 1992-07-31 2000-04-04 信越半導体株式会社 ウエーハ面取部研磨装置
US5972162A (en) * 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection
CN107444909B (zh) * 2017-08-30 2023-05-12 江西衡源智能装备股份有限公司 大尺寸工件自动化加工装置
CN109551304A (zh) * 2018-10-30 2019-04-02 广东劲胜智能集团股份有限公司 一种超薄陶瓷指纹片研磨工艺
CN109605150A (zh) * 2019-01-12 2019-04-12 陕西理工大学 一种平面打磨抛光机
CN111975511B (zh) * 2020-08-18 2022-05-06 江西衡源智能装备股份有限公司 一种带自动上下料的数控加工中心及其自动上下料方法

Also Published As

Publication number Publication date
JPS59227361A (ja) 1984-12-20

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